E-NORM electrical components German E-NORM models E-NORM prices

E-NORM electrical components refer to circuit boards, including: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, printed wiring boards, PCB boards, aluminum substrate boards, high-frequency boards, thick copper boards, impedance-controlled boards, PCB, ultra-thin printed wiring boards, ultra-thin circuit boards, and printed (copper etching technology) circuit boards. Circuit boards miniaturize and visualize circuits, playing a crucial role in the mass production of fixed circuits and optimizing appliance layouts. Circuit boards are also known as printed wiring boards or printed circuit boards. Flexible printed wiring boards and flexible circuit boards are made using polyimide or polyester film as the base material, offering high reliability and excellent flexibility. They feature high wiring density, light weight, thin profile, and good bendability.) and rigid-flex boards—the emergence and development of FPC and PCB have given rise to the new product category of rigid-flex boards. Therefore, rigid-flex boards are circuit boards formed by combining flexible printed wiring boards and rigid printed wiring boards through lamination and other processes according to relevant technical requirements, possessing both FPC characteristics and PCB characteristics.

E-NORM electrical component functions

Low-power resistors are typically composed of carbon film encapsulated in a plastic housing, while high-power resistors are usually wirewound resistors, made by winding metal wire with high resistivity around a ceramic core. If a resistor's resistance value is close to zero ohms (for example, a large-cross-section wire between two points), the resistor offers no obstruction to current, and the circuit parallel to such a resistor is short-circuited, resulting in infinite current. If a resistor has infinite or very high resistance, the circuit series-connected with this resistor can be regarded as an open circuit, with zero current. Resistors commonly used in industry fall between these two extremes; they have a certain resistance and allow a specific current to pass, but the current is not as large as in a short circuit. The current-limiting function of a resistor is similar to that of a small-diameter pipe connected between two large-diameter pipes restricting water flow. Resistance, usually abbreviated as R, is a fundamental property of a conductor, related to the conductor's size, material, and temperature. Ohm's law states that I = U/R, so R = U/I. The basic unit of resistance is the ohm, represented by the Greek letter "Ω". It is defined as the resistance value corresponding to a current of one ampere generated when one volt of voltage is applied across a conductor. The main function of a resistor is to hinder current flow. In fact, "resistance" refers to a property, while "resistor" in electronic products usually refers to the component itself. Ohm is often abbreviated as ohm. Common units for expressing resistance values also include kilo-ohm (kΩ), mega-ohm (MΩ), and milli-ohm (m Ω).

E-NORM electrical component structure

Common electrodynamic cone paper loudspeakers. Electrodynamic cone loudspeakers were formerly known as paper cone loudspeakers; although the diaphragm is still primarily paper-based, many polymer material diaphragms and metal diaphragms have emerged, making the term cone loudspeaker more accurate. Cone paper loudspeakers generally consist of three main parts: the magnetic circuit system (permanent magnet, pole piece, magnetic plate), the vibration system (paper cone, voice coil), and the support auxiliary system (spider, basket, surround). 1. Voice coil: The voice coil is the drive unit of the cone paper loudspeaker. It is made by winding very fine copper wire in two layers around a paper tube, typically with dozens of turns, also known as a coil. It is placed in the magnetic gap formed by the magnetic pole piece and the magnetic plate. The voice coil is fixed to the paper cone. When an audio current signal passes through the voice coil, the vibration of the voice coil drives the paper cone to vibrate. 2. Paper cone: There are many types of materials used for the cone diaphragm of cone paper loudspeakers, generally divided into natural fibers and synthetic fibers. Natural fibers often include cotton, wood, wool, and silk, while synthetic fibers include rayon, nylon, and fiberglass. Since the paper cone is the sound-radiating element of the loudspeaker, it largely determines the acoustic performance. Therefore, regardless of the type, the paper cone must be lightweight and rigid, and must not deform due to changes in ambient temperature or humidity. 3. Surround: The surround is designed to ensure axial movement of the paper cone along the loudspeaker axis and restrict lateral movement, while also preventing air leakage between the front and back of the paper cone. In addition to materials commonly used for paper cones, the surround may use plastics, natural rubber, etc., bonded to the paper cone through heat pressing. 15. Spider: The spider supports the junction of the voice coil and the paper cone, ensuring it remains vertical and not skewed. The spider has many concentric rings, allowing the voice coil to move freely up and down in the magnetic gap without lateral movement, ensuring the voice coil does not touch the magnetic plate. The dust cap on the spider prevents external dust from entering the magnetic gap, avoiding friction between dust and the voice coil, which could cause abnormal sounds in the loudspeaker. Generally, a loudspeaker consists of a magnet, frame, spider, molded surround, and cone paper diaphragm.

E-NORM electrical component features

Most microphones are electret condenser microphones (ECM), a technology with a history of several decades. The working principle of ECM utilizes a polymer diaphragm with permanently isolated charge. Compared to the polymer diaphragm of ECM, MEMS microphones exhibit stable performance across different temperatures and are unaffected by temperature, vibration, humidity, and time. Due to strong heat resistance, MEMS microphones can withstand high-temperature reflow soldering without any change in performance. Since the sensitivity change before and after assembly is minimal, this can even save audio debugging costs during the manufacturing process. Currently, integrated circuit processes are increasingly widely applied in the manufacturing of sensors and sensor interface integrated circuits. This micro-manufacturing process offers advantages such as precision, flexible design, miniaturization, integration with signal processing circuits, low cost, and mass production. A first-order resonant frequency in such a low frequency range would lead to highly uneven frequency response within the audible frequency range, which is unacceptable for microphone applications. When tensile stress exists within the sensitive membrane, its resonant frequency increases, but at the cost of sensitivity. Of course, higher first-order resonant frequencies can be obtained by adjusting the size of the sensitive membrane, but this will still reduce sensitivity. Thus, piezoresistive solutions are not suitable for the manufacture of miniature microphones. A feasible solution is to adopt capacitive schemes to manufacture miniature microphones. The advantage of this method is that all materials used in integrated circuit manufacturing processes can be used for sensor manufacturing. However, manufacturing micro-microphones using single-chip processes is quite difficult because the air medium between the two capacitor plates can only have a very small gap. Moreover, due to size limitations, bias voltage is difficult to satisfy in some application scenarios. Based on these issues, research on capacitive microphones has continued. Compared to traditional electret microphones, MEMS microphones offer advantages such as small size, good heat resistance, good consistency, good stability, high reliability, and resistance to RF interference. They can also output digital signals, facilitating intelligent development.

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