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abn braun electrical components include resistors, capacitors, inductors, diodes, transistors, field-effect transistors, thyristors, transformers, relays, sensors...; electronic devices include analog circuits (operational amplifiers, comparators, signal conditioners), logic circuits (flip-flops, counters, decoders, registers, transceivers, NOT gates, AND gates, OR gates, NAND gates, NOR gates, XOR gates), microcontrollers, memory, digital potentiometers, signal conversion circuits (A/D converters, D/A converters, voltage/frequency converters), communication circuits (various interface circuits), monitoring and reset circuits (power supply monitoring, program monitoring)..., too numerous to mention.

abn braun electrical component principles

In addition to the function of photodiodes to convert light signals into electrical signals, phototransistors also have the function of amplifying electrical signals. The appearance of a phototransistor is not much different from that of a general transistor. Generally, a phototransistor only leads out two terminals—the emitter and the collector—while the base is not led out. The casing also has a window to allow light to enter. To increase light exposure, the base region area is made large, while the emitter region is small, so that incident light is mainly absorbed by the base region. During operation, the collector junction is reverse-biased, and the emitter junction is forward-biased. In the absence of light, the current flowing through the tube is the dark current Iceo = (1 + β) Icbo (very small), which is smaller than the penetration current of general transistors; when there is light illumination, a large number of electron-hole pairs are excited, causing the current generated at the base Ib to increase. At this time, the current flowing through the tube is called photocurrent, and the emitter current Ie = (9 + β) Ib. It can be seen that phototransistors have higher sensitivity than photodiodes.

abn braun electrical component structure

A solid-state relay consists of three parts: input circuit, isolation, and output circuit. According to different categories of input voltage, the input circuit can be divided into DC input circuit, AC input circuit, and AC/DC input circuit. Some input control circuits also have functions compatible with TTL/CMOS, positive/negative logic control, and inversion, allowing convenient connection with TTL and MOS logic circuits. For control signals with fixed control voltage, resistive input circuits are used. The isolation and coupling methods between the input and output circuits of solid-state relays include optocoupling and transformer coupling: optocoupling usually uses photodiode-phototransistor, photodiode-bidirectional light-controlled thyristor, or photovoltaic cells to achieve isolated control between the control side and the load side; high-frequency transformer coupling utilizes the self-excited high-frequency signal generated by the input control signal, which is coupled to the secondary side, detected, rectified, and processed by logic circuits to form a drive signal. The power switch of the solid-state relay is directly connected to the power supply and load terminals to realize the on/off switching of the load power. Mainly used components include high-power bipolar transistors, unidirectional thyristors, bidirectional thyristors, power field-effect transistors, and insulated-gate bipolar transistors. The output circuit of a solid-state relay can also be divided into DC output circuit, AC output circuit, and AC/DC output circuit forms. According to the load type, it can be divided into DC solid-state relays and AC solid-state relays. Bipolar devices or power field-effect transistors can be used for DC output, while two thyristors or one bidirectional thyristor are usually used for AC output. AC solid-state relays can be further divided into single-phase AC solid-state relays and three-phase AC solid-state relays. AC solid-state relays can be classified into random-turn-on AC solid-state relays and zero-crossing AC solid-state relays according to the timing of turn-on and turn-off.

abn braun electrical component structure

Inductors generally consist of a bobbin, winding, shield, encapsulation material, magnetic core or iron core. 1. Bobbin: A bobbin refers to the support for winding coils. For larger fixed inductors or adjustable inductors (such as oscillator coils and choke coils), enameled wire (or silk-covered wire) is mostly wound around the bobbin, and then a magnetic core, copper core, or iron core is inserted into the inner cavity of the bobbin to increase its inductance. Bobbins are usually made of plastic, bakelite, or ceramic, and can be formed into different shapes according to actual needs. Small inductors (such as color-coded inductors) generally do not use bobbins; instead, the enameled wire is wound directly onto the magnetic core. Air-core inductors (also known as former-less coils or air-core coils, mostly used in high-frequency circuits) do not use magnetic cores, bobbins, or shields. Instead, they are wound on a mold first, then the mold is removed, and a certain distance is maintained between each turn of the coil. 2. Winding: A winding refers to a set of coils with specified functions and is the basic component of an inductor. Windings are classified into single-layer and multi-layer types. Single-layer windings come in two forms: close-wound (where wires are wound turn by turn adjacent to each other) and spaced-wound (where a certain distance is kept between each turn during winding). Multi-layer windings include layered flat winding, random winding, honeycomb winding, and other methods. 3. Magnetic Core and Magnetic Rod: Magnetic cores and magnetic rods are generally made of materials such as nickel-zinc ferrite or manganese-zinc ferrite. They come in various shapes, including "I" shape, cylindrical, cap-shaped, "E" shape, and pot shape. 4. Iron Core: Iron core materials mainly include silicon steel sheets and permalloy, and their shape is mostly "E" type. 5. Shield: To prevent the magnetic field generated by some inductors during operation from affecting the normal operation of other circuits and components, a metal shield is added (such as for oscillator coils in semiconductor radios). Using a shield increases coil losses, reducing the Q value. 9. Encapsulation Material: Some inductors (such as color-coded inductors and color-ring inductors) are sealed with encapsulation material after winding to enclose the coil and magnetic core. The encapsulation material is typically plastic or epoxy resin.

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